5123导航取五湖之利取四-欢迎莅临

职称:教授

电话:010-62796127

E-mail address:yihuizhang@tsinghua.edu.cn

个人简介

张一慧,博士,澳门所有娱乐官方网站链工程力学系长聘教授。2011年在清华大学航天航天学院工程力学系获博士学位。2011年至2015年在美国西北大学土木与环境工程系先后担任Postdoctoral Fellow和Research Assistant Professor。2015年加入清华大学工程力学系,历任副教授、长聘副教授、长聘教授。

联系方式:清华大学学院蒙民伟科技大楼N-629,100084

电话:010-62796127

Email:yihuizhang@tsinghua.edu.cn

研究组主页:http://yihuizhang.org

教育背景

2002.9-2006.6 南京航空航天大学 飞行器设计与工程专业学士

2006.8-2008.7 清华大学 工程力学硕士

2008.9-2011.6 清华大学 工程力学博士

工作履历

2011.10-2014.6 美国西北大学,土木与环境工程系 Postdoctoral Fellow

2014.6-2015.3 美国西北大学,土木与环境工程系 Research Assistant Professor

2015.3-2019.12 清华大学,工程力学系 副教授/长聘副教授

2019.12-至今 清华大学,工程力学系 长聘教授

学术兼职

《Mechanics of Materials》:Editor(2023-),Associate Editor(2019-2022);

《Science Advances》:Associate Editor(2021-);

《Research》:Associate Editor(2019-);

《International Journal of Smart and Nano Materials》:Associate Editor(2022-);

《ASME-Journal of Applied Mechanics》:Associate Editor(2017-2022);

《Current Opinion in Solid State & Materials Science》编委(2019-);

《Theoretical and Applied Mechanics Letters》编委(2018-);

《npj Flexible Electronics》编委(2016-);

《固体力学学报》编委(2020-);

《Proceedings of the Royal Society A》编委(2017-2022);

《SCIENCE CHINA Technological Sciences》中英文版青年编委(2018-)

社会兼职

国际工程科学协会,执委会成员(Member, SES Board of Directors)(2020-2022);

中国力学学会软物质力学工作组,副组长(2018-);

中国力学学会电子电磁器件力学工作组,副组长(2020-);

中国硅酸盐学会微纳技术分会,理事(2018-);

中国复合材料学会智能复合材料专业委员会,委员(2019-)。

研究领域

力学引导的三维微结构组装,非常规软材料,柔性可延展电子器件,智能材料与结构力学

研究概况

致力于利用力学原理和多学科交叉解决世界科技前沿领域中的挑战性科学问题,在此过程中建立先进材料和结构的新力学理论和计算模型, 并发展具有特异性能的材料和系统的设计及制造方法。当前的主要研究焦点是柔性微结构技术,侧重于发展能够重现或超越生物软组织力学/物理性能的结构化软材料,以及能够提供新功能或高性能的三维微电子器件。

1. 建立力学引导的微尺度三维结构组装新方法,提出力学设计新概念,建立三维组装的大变形理论、计算力学方法、实验技术及反问题设计方法,发展该方法在三维微电子器件、微机电系统及电磁器件中的新型应用

2. 发展具有仿生或非常规力学特性的结构化软材料,研究结构化软材料的制备方法、非线性细观力学模型、失效机理及实验技术,探索在生医器件及组织工程领域中的应用

3. 发展柔性可延展电子器件及系统的力学设计新理念,建立力学分析的理论模型及计算方法

奖励与荣誉

2022年 国家杰出青年科学基金

2022年 国际机械工程荣誉协会与美国机械工程师协会联合颁发的Gustus L. Larson Memorial奖

2022年 科睿唯安高被引学者(交叉学科)

2021年 科学探索奖(前沿交叉领域)

2020年 科睿唯安高被引学者(交叉学科)

2020年 北京地区广受关注学术论文(力学学科),北京市科协

2019年 美国机械工程师协会Thomas J.R. Hughes青年学者奖

2019年 清华大学第八届青年教师教学大赛(工科组)一等奖

2018年 国际工程科学协会Young Investigator Medal

2018年 美国机械工程师协会Sia Nemat-Nasser早期职业生涯奖

2017年 Eshelby青年力学教授奖

2017年 清华大学“学术新人奖”

2017年 清华大学年度教学优秀奖

2017年 美国机械工程师协会最高论文奖Melville Medal

2017年 国家自然科学基金委优秀青年科学基金

2017年 美国机械工程师协会Journal of Applied Mechanics Award

2016年 入选《麻省理工学院技术评论》全球35位35岁以下创新者(MIT TR35)

2016年 香港求是科技基金会“杰出青年学者奖”

学术成果

至今已获得授权的中国发明专利6项、美国发明专利3项,出版学术专著1部,发表学术论文160余篇,其中以通讯作者在《Science》、《Nature》、《Nature Materials》、《Nature Electronics》、《Nature Reviews Materials》、《Nature Communications》、《Science Robotics》、《Science Advances》、《PNAS》、《JMPS》、《Advanced Materials》、《ACS Nano》等期刊发表高水平学术论文90余篇。十余篇论文被《Science》、《Nature》、《Nature Materials》、《Nature Electronics》、《Nature Reviews Materials》、《Science Advances》等期刊选为封面文章。这些研究成果被《Nature》、《Science》、《Nature Materials》、《Nature Reviews Materials》、《PNAS》等期刊在Research Highlights、Perspectives或News & Views/Opinions专栏中焦点报道,同时得到ASME News、Chemistry Views、IOP Physics World、Materials Views、MIT Technology Review、Royal Society of Chemistry等专业机构追踪,还多次受到BBC、Discovery、Fox、Wall Street Journal、参考消息、新华网、人民网等国内外重要媒体报道。

代表性论文包括(*表示通讯作者;+表示并列第一作者):

[1]Cheng X+, Fan Z+, Yao S, Jin T, Lv Z, Lan Y, Bo R, Chen Y, Zhang F, Shen Z, Wan H, Huang Y, Zhang YH*. Programming 3D Curved Mesosurfaces using Microlattice Designs. Science, 2023, 379: 1225-1232

--- Highlighted by Nature (2023, 616: 10), “Microstructures mimic life’s endless forms”.

[2]Shuai Y+, Zhao J+, Bo R, Lan Y, Lv Z, Zhang YH*. A wrinkling-assisted strategy for controlled interface delamination in mechanically-guided 3D assembly. Journal of the Mechanics and Physics of Solids, 2023, 173: 105203

[3]Pang W+, Xu S+, Wu J, Bo R, Jin T, Xiao Y, Liu Z, Zhang F, Cheng X, Bai K, Song H, Xue Z, Wen L, Zhang YH*. A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces. PNAS, 2022, 119: e2215028119

[4]Xue Z+, Jin T+, Xu S, Bai K, He Q, Zhang F, Cheng X, Ji Z, Pang W, Shen Z, Song H, Zhang YH*. Assembly of complex 3D structures and electronics on curved surfaces. Science Advances, 2022, 8: eabm6922

--- Featured on the cover of August 12, 2022 issue of Science Advances

--- Highlighted by Nature Reviews Materials (2022, 7: 681), “Pop-up shapes”.

--- Highlighted on the homepage of Science website

[5]Han M+, Guo X+, Chen X+, Liang C, Zhao H, Zhang Q, Bai W, Zhang F, Wei H, Wu C, Cui Q, Yao S, Sun B, Yang Y, Yang Q, Wu C, Ma Y, Xue Z, Kwak JW, Jin T, Tu Q, Song E, Tian Z, Mei Y, Fang D, Zhang H, Huang Y*, Zhang YH*, Roger JA*. Sub-millimeter scale multi-material terrestrial robots. Science Robotics, 2022, 7: eabn0602

--- Highlighted on the homepage of Science Robotics website

[6]Song H+, Luo G+, Ji Z, Bo R, Xue Z, Yan D, Zhang F, Bai K, Liu J, Cheng X, Pang W, Shen Z, Zhang YH*. Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials. Science Advances, 2022, 8: eabm3785

--- Featured on the cover of March 18, 2022 issue of Science Advances

[7]Cheng X, Zhang F, Bo R, Shen Z, Pang W, Jin T, Song H, Xue Z, Zhang YH*. An anti-fatigue design strategy for 3D ribbon-shaped flexible electronics. Advanced Materials, 2021, 33: 2102684

--- Featured on the Back Cover of Sep 16, 2021 issue of Advanced Materials

[8]Liu J+ Yan D+, Pang W, Zhang YH*. Design, Fabrication and Applications of Soft Network Materials. Materials Today, 2021, 49: 324-350

--- Featured on the inner cover of October 2021 issue of Materials Today

[9]Kim BH+, Li K+, Kim JT+, Park Y+, Jang H, Wang X, Xie Z, Won SM, Yoon HJ, Lee G, Jang WJ, Lee KH, Chung TS, Jung YH, Heo SY, Lee Y, Kim J, Cai T, Kim Y, Prasopsukh P, Yu Y, Yu X, Avila R, Luan H, Song H, Zhu F, Zhao Y, Chen L, Han SH, Kim J, Oh SJ, Lee H, Lee CH, Huang Y*, Chamorro LP*, Zhang YH*, Rogers JA*. Three-Dimensional Electronic Microfliers Inspired by Wind-Dispersed Seeds. Nature, 2021, 597: 503-510

--- Featured on the cover of Sep 23, 2021 issue of Nature

--- Highlighted by Nature (Vol 597, 2021, 480-481), “Seed-inspired vehicles take flight”.

[10]Zhang H, Wu J, Fang DN*, Zhang YH*. Hierarchical mechanical metamaterials built with scalable tristable elements for ternary logic operation and amplitude modulation. Science Advances, 2021, 7: eabf1966

[11]Wu J, Yao S, Zhang H, Man W, Bai Z, Zhang F, Wang X, Fang DN*, Zhang YH*. Liquid crystal elastomer metamaterials with giant biaxial thermal shrinkage for enhancing skin regeneration. Advanced Materials, 2021, 33: 2106175

--- Featured as Editor’s Choice

[12]Liu J, Yan D, Zhang YH*. Mechanics of unusual soft network materials with rotatable structural nodes. Journal of the Mechanics and Physics of Solids, 2021, 146: 104210

--- 被选为北京市科协“首都前沿学术成果”(力学学科)

[13]Guo X+, Ni X+, Li J+, Zhang H, Zhang F, Yu H, Wu J, Bai Y, Lei H, Huang Y, Rogers JA*, Zhang YH*. Designing mechanical metamaterials with kirigami-inspired, hierarchical constructions for giant positive and negative thermal expansion. Advanced Materials, 2021, 33: 2004919

--- Featured on the Front Cover of Jan 21, 2021 issue of Advanced Materials

[14]Bai K, Cheng X, Xue Z, Song H, Sang L, Liu F, Zhang F, Luo X, Huang W, Huang Y, Zhang YH*. Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy. Science Advances, 2020, 6: eabb7417

[15]Yan D+, Chang J+, Zhang H, Liu J, Song H, Xue Z, Zhang F, Zhang YH*. Soft Three-Dimensional Network Materials with Rational Bio-mimetic Designs. Nature Communications, 2020, 11: 1180

[16]Pang W, Cheng X, Zhao H, Guo X, Ji Z, Li G, Liang Y, Xue Z, Song H, Zhang F, Xu Z, Sang L, Huang W, Li T, Zhang YH*. Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms. National Science Review, 2020, 7: 342-354

[17]Fan Z+, Yang Y+, Zhang F, Xu Z, Zhao H, Wang T, Song H, Huang Y*, Rogers JA*, Zhang YH*. Inverse design strategies for 3D surfaces formed by mechanically guided assembly. Advanced Materials, 2020, 32: 1908424

[18]Liu Y+, Wang X+, Xu Y, Xue Z, Zhang Y, Ning X, Cheng X, Xue Y, Lu D, Zhang Q, Zhang F, Liu J, Guo X, Hwang KC, Huang Y*, Rogers JA*, Zhang YH*. Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling. Proceedings of the National Academy of Sciences of the United States of America, 2019, 116: 15368-15377

[19]Cheng X, Zhang YH*. Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving and Buckling Approaches. Advanced Materials, 2019, 31: 1901895

--- Featured on the Inside Front Cover of Sep 6, 2019 issue of Advanced Materials

[20]Luo G+, Fu H+, Cheng X, Bai K, Shi L, He X, Rogers JA, Huang Y, Zhang YH*. Mechanics of bistable cross-shaped structures through loading-path controlled 3D assembly. Journal of the Mechanics and Physics of Solids, 2019, 129: 261-277

[21]Han M+, Wang H+, Yang Y, Liang C, Bai W, Yan Z, Li H, Xue Y, Wang X, Akar B, Zhao H, Luan H, Lim J, Kandela I, Ameer GA, Zhang YH*, Huang Y*, Rogers JA*. Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic prosthetic interfaces, and biomedical implants. Nature Electronics, 2019, 2: 26-35

--- Featured on the cover of January issue of Nature Electronics

--- Highlighted by Nature Electronics (Vol 2, 2019, 15-16), “3D piezoelectric microsystems pop up”.

[22]Zhang H, Guo X, Wu J, Fang DN*, Zhang YH*. Soft Mechanical Metamaterials with Unusual Swelling Behavior and Tunable Stress-strain curves. Science Advances, 2018, 4, eaar8535

[23]Fu H+, Nan K+, Bai W, Huang W, Bai K, Lu L, Zhou C, Liu YP, Liu F, Wang J, Han M, Yan Z, Luan H, Zhang YJ, Zhang YT, Zhao J, Cheng X, Li M, Lee JW, Liu Y, Fang D, Li X, Huang YG*, Zhang YH*, Rogers JA*. Morphable 3D Mesostructures and Microelectronic Devices by Multistable Buckling Mechanics. Nature Materials, 2018, 17: 268-276

--- Featured on the cover of March 2018 issue of Nature Materials

[24]Fan Z, Hwang KC*, Rogers JA, Huang YG, Zhang YH*. A double perturbation method of postbuckling analysis in 2D curved beams for assembly of 3D ribbon-shaped structures. Journal of the Mechanics and Physics of Solids, 2018, 111: 215-238

[25]Zhang YH*, Zhang F, Yan Z, Ma Q, Li XL, Huang YG, Rogers JA*. Printing, Folding and assembly methods for forming 3D mesostructures in advanced materials. Nature Reviews Materials, 2017, 2: 17019

--- Featured on the cover of April 2017 issue of Nature Reviews Materials

[26]Ma Q, Cheng H, Jang KI, Luan H, Hwang KC, Rogers JA, Huang YG, Zhang YH*. A nonlinear mechanics model of bio-inspired hierarchical lattice materials consisting of horseshoe microstructures. Journal of the Mechanics and Physics of Solids, 2016, 90: 179-202

--- 被选为北京市科协“北京地区广受关注学术论文”(力学学科)

[27]Ma Q, Zhang YH*. Mechanics of fractal-inspired horseshoe microstructures for applications in stretchable electronics. Journal of Applied Mechanics, 2016, 83: 111008

--- Awarded the ASME Melville Medal, the highest ASME honor for the best original paper which has been published in the ASME Transactions during the two calendar years immediately preceding the year of the award

[28]Xu S+, Yan Z+, Jang KI, Huang W, Fu HR, Kim JH, Wei ZJ, Flavin M, McCracken J, Wang RH, Badea A, Liu Y, Xiao DQ, Zhou GY, Lee JW, Chung HU, Cheng HY, Ren W, Banks A, Li XL, Paik U, Nuzzo RG, Huang YG*, Zhang YH*, Rogers JA*. Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling. Science, 2015, 347: 154-159

--- Featured on the Cover of Jan 9, 2015 issue of Science

--- Highlighted by Science (Vol 347, 2015, 130-131), “Three-dimensional nanostructures pop up”.

--- Highlighted by Nature (Vol 517, 2015, 247), “Silicon buckles to form 3D shapes”.

[29]Zhang YH+, Yan Z+, Nan KW, Xiao DQ, Liu YH, Luan HW, Fu HR, Wang XZ, Yang QL, Wang JC, Ren W, Si HZ, Liu F, Yang LH, Li HJ, Wang JT, Guo XL, Luo HY, Wang L, Huang YG*, Rogers JA*. A mechanically driven form of Kirigami as a route to 3D mesostructures in micro/nanomembranes. Proceedings of the National Academy of Sciences of the United States of America, 2015, 112, 11757-11764

[30]Xu S+, Zhang YH+, Jia L+, Mathewson KE+, Jang KI, Kim JH, Fu HR, Huang X, Chava P, Wang RH, Bhole S, Wang LZ, Na YJ, Guan Y, Flavin M, Han ZS, Huang YG*, Rogers JA*. Soft Microfluidic Assemblies of Sensors, Circuits and Radios for the Skin. Science, 2014, 344: 70-74

--- This work was highlighted as an item and feature image in the News of the Week on the Science website.

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